multichip module
英 [ˌmʌltɪˈtʃɪp ˈmɒdjuːl]
美 [ˌmʌltiˈtʃɪp ˈmɑːdʒuːl]
网络 多芯片组件; 多芯片模块; 多晶片模块; 多晶片模組; 多芯片模型贴装
双语例句
- This challenge makes multichip module ( MCM) a necessity.
这种挑战使得多芯片模块（MCM）成为必然的选择。 - Technology of microwave multichip module
微波多芯片模块技术 - Using multichip module ( MCM) technology, The theory and design for the two-channel millimeter wave front-end is present in this thesis.
所以进行本课题的研究就非常有实际意义。本文采用多芯片组件（MCM）技术对毫米波双通道接收前端进行了理论分析和设计，，并且进行了制作和测试。 - Analysis of Simultaneously Switching Noise on the Conductive Planes in Multichip Module ( MCM) with Partial Element Equivalent Circuit ( PEEC) Method
以PEEC方法分析MCM中导体板上同步开关噪声 - This dissertation is mainly on the research of S-band multichip module ( MCM) 4-bit digital phase shifter and switch section.
本论文主要是对S波段MCM四位数字移相器开关组件进行研究。 - Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging, multichip package and module MEMS are introduced.
介绍了几种当前先进的MEMS封装技术：倒装焊MEMS、多芯片（MCP）和模块式封装（MOMEMS）。 - FEA Method in the Thermal Performance of Multichip Module
有限元热分析法在大功率多芯片组件中的应用 - Multichip module technology ( MCM) is the optimal way of providing circuit system miniaturization.
多芯片组件技术（MCM）促使电路系统小型化过渡的最好形式。 - Application of Infrared Thermography Technology to Microwave Multichip Module
红外热像技术在微波多芯片组件中的应用 - This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption, low weight and compact systems.
简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。 - As compared with traditional package technologies, multichip module ( MCM) technology has the higher packing densities and the more excellent characteristics.
与传统的封装技术相比，多芯片组装技术具有更高的封装密度和更优异的性能。 - 3-D Multichip Module ( MCM) is the developing trend of microelectronic packaging in the future.
3-D多芯片组件（MCM）是未来微电子封装的发展趋势。 - This paper describes the features of LTCC three dimension Multichip module technology, and analyzes the development trend of LTCC 3D-MCM.
本文概述了低温共烧陶瓷（LTCC）三维多芯片组件技术的特点，并分析LTCC3D-MCM的发展趋势。 - This paper describes a multichip module having a copper-polyimide thin-film multiplayer substrate. This new substrate overcomes the problems of increased transmission loss at high frequencies while maintaining low crosstalk noise and the increased simultaneous switching noise with the large number of LSI chips.
介绍了一种采用铜-聚酰亚胺薄膜多层基板的多芯片组件（MCM），它解决了高频下维持较低交调噪声带来的传输损耗增大，以及大量LSI芯片的同时切换噪声增大的问题。 - Analysis of Interconnects in Multichip Module by Moment of Method
多芯片组件（MCM）中互连线系统的矩量法分析 - Three Dimensional Finite Element Analysis of Heat Dissipation of Multichip Module
多芯片组件散热的三维有限元分析 - Bonding interconnect is the critical technique for realizing the interconnect of microwave multichip module ( MCM). The height, distance and number of wires of bonding interconnect have important effects on its microwave characteristics.
键合互连是实现微波多芯片组件电气互连的关键技术，键合互连的拱高、跨距和金丝根数对其微波特性具有很大的影响。